Haier Techlink Challenge 2020

What is Haier Techlink Challenge?

Initiated by Haier Israel Innovation Center, Haier Techlink Challenge is aimed to identify European and Israeli companies with Smart Sensing Technologies relevant for Smart Home and Appliances .

Relevant applications will be reviewed and evaluated by Haier’s experts from the global R&D centers. The 10 best applicants will present their technologies to a jury panel later this year.

What Benefit Will be Granted to the Winning Startups?
In addition to the opportunity of implementing your idea with Haier Smart Products, the best 10 applications will receive fully sponsored visits (travel and accommodation expenses will be paid by Haier) to Haier’s global headquarters in Qingdao, China, where you will have the opportunity to meet your counterparts at Haier’s global product lines. The visit will take place during Haier’s annual Global R&D Summit in March 2021.

DATE LIMITE POUR CANDIDATER

31 

OCTOBRE 2020

Je candidate

Abonnez-vous à la newsletter HDFID

Siège HDFID

135 boulevard Paul Painlevé 59000, Lille

Antenne Amiens

41 Avenue Paul Claudel

80480 DURY 

Antenne d'Etaples

Centre d’affaires OPALOPOLIS 

Parc d’Activité Opalopolis, Boulevard Edouard Lévêque

62630 ETAPLES 

Antenne de Senlis

CETIM

52 avenue Félix Louat
60300 SENLIS 

Antenne de Valenciennes

Maison des Entreprises Grand Hainaut

40 route d’Aulnoy
59300 VALENCIENNES