What is Haier Techlink Challenge?
Initiated by Haier Israel Innovation Center, Haier Techlink Challenge is aimed to identify European and Israeli companies with Smart Sensing Technologies relevant for Smart Home and Appliances .
Relevant applications will be reviewed and evaluated by Haier’s experts from the global R&D centers. The 10 best applicants will present their technologies to a jury panel later this year.
What Benefit Will be Granted to the Winning Startups?
In addition to the opportunity of implementing your idea with Haier Smart Products, the best 10 applications will receive fully sponsored visits (travel and accommodation expenses will be paid by Haier) to Haier’s global headquarters in Qingdao, China, where you will have the opportunity to meet your counterparts at Haier’s global product lines. The visit will take place during Haier’s annual Global R&D Summit in March 2021.
DATE LIMITE POUR CANDIDATER
31
OCTOBRE 2020
Je candidate
JE CANDIDATE
Abonnez-vous à la newsletter HDFID
Siège HDFID
Antenne Amiens
41 Avenue Paul Claudel
80480 DURY
Antenne d'Etaples
Centre d’affaires OPALOPOLIS
Parc d’Activité Opalopolis, Boulevard Edouard Lévêque
62630 ETAPLES
Antenne de Senlis
CETIM
52 avenue Félix Louat
60300 SENLIS
Antenne de Valenciennes
Maison des Entreprises Grand Hainaut
40 route d’Aulnoy
59300 VALENCIENNES
Nous contacter:
(+33) 03 74 09 07 07
contact@hautsdefrance-id.fr